Apple Airtag - Teardown Report

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Apple Airtag - Teardown Report

Report description

Total pages: 18

This analysis provides a technical examination of the Apple AirTag’s internal architecture, documenting the key hardware components and engineering choices behind the ultra-wideband (UWB) tracking device.

The report evaluates the device’s physical construction, including its ingress protection (IP67) seals and battery housing, while providing a component-level breakdown of the radio frequency (RF) and power management systems. This objective overview is intended for hardware engineers, security researchers, project managers and consumer electronics analysts seeking data on high-density PCB design and low-power wireless integration.

Table of contents

1 Introduction & disclaimer

2 Device specs

3 Teardown

4 BOM cost analysis

5 Market context

6 Contact

Apple AirTag Teardown – FAQ

Q. What hardware components are analyzed in the AirTag teardown?

A. The report provides a detailed breakdown of the internal logic board, including the proprietary Apple U1 Ultra-Wideband (UWB) silicon, the Bluetooth Low Energy (BLE) controller, and all the main ICs present in the PCB.

Q. Is a Bill of Materials (BOM) included in the analysis?

A. The full technical report identifies key integrated circuits (ICs), providing a comprehensive overview of the component-level engineering behind the device.